Technical description

Full equipment name: Wet bench TMAH (tetramethylammonium hydroxide) W19
General purpose: Etching of silicon with TMAH
Technical data:
• One quartz bath with heating for 6” wafers (1)
• One water bath with heating for 6” wafers (2)
• Aspirator (syrasug)
• DI-water gun
• Nitrogen gun
• Cassettes, cassette holders and single wafer holders marked brown.

Full equipment name: Wet bench HF W20
General purpose: Etching of silicon oxide films
Technical data:
• PVDF bath for 6” wafers with valve (3)
• Bubbler for 6” wafers (4)
• Cassettes, cassette holders and single wafer holders marked brown.

Full equipment name: Wet bench KOH W21
General purpose: Anisotropic etching of silicon with KOH
Technical data:
• 2 Quartz bath with heating and stirring for 6” wafers (5) and (7)
• Bubbler for 6” wafers (6)
• Water heat bath for 6” wafers (8)
• Nitrogen gun
• DI Water gun
• Aspirator
• Cassettes, cassette holders and single wafer holders marked brown.