NO METALS, NO METAL- OR RESISTSTRIP ALLOWED!

Technical description

Full equipment name: Wet Bench  W41
General purpose: Cleaning wafers/samples
Technical data:
• Wet bench for 4 inch substrates
• Chemicals: Acetic acid (CH3COOH), Nitric acid (HNO3), Hydrochloric acid (HCl)
• Heated quartz bath
• Bubbler
• Emergency Power Off button
• Cassettes, cassette holders and single wafer holders with blue marking

Full equipment name: Wet Bench RCA-1 W46
General purpose: Cleaning wafers/samples from organic residue
Technical data:
• Wet bench for 4 inch substrates
• Chemicals: Ammonia (NH4OH), Hydrogen Peroxide (H2O2)
• Heated quartz bath
• Bubbler
• Cassettes, cassette holders and single wafer holders with yellow markings

Full equipment name: Wet Bench RCA-2 W47
General purpose: Cleaning wafers/samples from metallic residue and oxide
Technical data:
• Wet bench for 4 inch substrates
• Chemicals: Hydrochloric acid (HCl), Hydrogen Peroxide (H2O2), HF 5%
• Heated quartz bath
• HF 5% bath with drain valve
• Aspirator
• DIW-gun
• Cassettes, cassette holders and single wafer holders with yellow markings

Full equipment name:: Spintork (no number)

Full equipment name: Wet bench W17

General purpose: Cleaning prior to Si epi or furnace deposition
Technical data:
• RCA1: 2250 ml H2O, 450 ml H2O2, 225 ml NH3
• RCA2: 2000 ml H2O, 400 ml H2O2, 400 ml HCl
• 7-up (Piranha cleaning): 3 to 1 solution H2SO4/H2O2

Full equipment name: Wet bench W18
General purpose:
Technical data:
• HF solutions, including IMEC