Instructors: Roger Wiklund (08/632 7817)

Technical description

Full equipment name: Commonwealth Scientific Corporation Ion Beam Sputtering Tool
General purpose: Deposition of metals, metal alloys, semiconductors and dielectric films by the sputter process
Technical data:
• Base Pressure: 6E-6 Torr
• Process Press. Range: 2,0 – 5,0E-4 Torr
• Ion Source Gas: Ar
• 10” Target Positions: 4
• Substrate Chucks/Planets: 3,5 cm & 2”, 4”, 6”
• Computer: IBM7585 PO2 Industrial Computer
• Cryopump: CTI – 10
• Cryocompressor: CTI – 8510
• Mech. Pump: Pfeiffer Duo 065D
• Motor Drivers: Compumotor SX6 (2 items)
• Power Supply: CSC – IBS 1200 (16 cm Ion Source)
• Power Supply: CSC – MARK II (Wafer Preclean Ion Source)
• Power Supply: CSC – PBN (Plasma Bridge Neutralizer Ion Source)