Technical description
Full equipment name: TePla Model 300 Plasma System
General purpose: Photoresist stripping, substrate surface cleaning
Technical data:
• Microwave generator: 2,45 GHz / 1000 W
• Installed gases: N2, O2
• Dry pump: Busch – Cobra DS80
• Process pressure range: 0,2 – 2,0 mbar
• Temperature probe: Raytek IR sensor