Technical description
Full equipment name: Plasmaline B300RF
General purpose: Dry etching of photoresist film in oxygen plasma.
Technical data:
- RFX600 Advanced Energy
- controller with PLC S7
- Chamber heating max 100 C
- Frequency 13.56 MHz
- Max power 500 W
- Process pressure: 1.3 mTorr
- One gas line: Oxygen
- Air cooling
- Maximum wafer size: 5" x 25 wafers