General
The AMC500 is a fully automatised spray equipment for front-end-of-line wet cleaning. Both single-side and double-side cleaning is possible thanks to the robotic handler being able to flip the wafer up-side-down.
The following solutions are available:
- Sulphuric-peroxide mixture (SPM), ~100 °C, removes gross organic materials and photoresist
- Dilute HF (1 %), removes chemical and native oxides
- SC-1 with megasonic (1:100 NH3(aq) in DIW), removes particles
- SC-2 (1:10 HCl(aq) in DIW), removes metallic contamination
Wafers are dry-in-dry-out, with centrifugal drying after cleaning
The equipment can process 100 mm, 150 mm and 200 mm wafers (hardware reconfiguration is required)
Restrictions
Wafers with gold and/or silver films/materials are not allowed in the tool (trace element contamination is ok)
Do not put "dirty" wafers in the receiver cassette
The equipment is only for wafer substrates, do not attempt to clean pieces with the equipment
The equipment is intended for cleaning and not etching, talk with tool responsible before doing any etch-processes
The equipment is intended for front-end-of-line cleaning, talk with tool responsible if you want to clean wafers that contain metals and/or silicides
Talk with tool responsible if you want to clean wafers that have been subjected to in-house CMP processes
The following materials are allowed in AMC500, talk with tool responsible if you want to clean something that is not included in the list
- Substrates: Silicon, Germanium, SiC, borosilicate glass, fused silica, quartz
- Thin-films: SiGe, polysilicon, SiO2, SiNx, Si3N4
- Standard photoresists SPR 700-1.2, TCIR ZR8690, AZ4533, S1813