The ULVAC Enviro-1Xa tool is used to stripp resist using a remote O2-plasma with low charging and etch damage on the wafer.
It is a single wafer tool that handles 100 mm wafers by default and can handle 150 mm wafer after 20 min re-configuration. Pieces can be processed using carrier wafers (speak to tool responsible before running pieces).
Typical etch rates are 13 µm/min and to strip 1 µm resist takes 10 seconds.
High etch rates is achieved by having the chuck heated to 250 ºC during stripping.
Wafers with Au, Cr or Cu is not allowed in the tool.