General
The ULVAC Enviro-1Xa tool is used to strip resist using a remote O2-plasma with low charging and etch damage on the wafer.
It is a single wafer tool that handles 150 mm wafers by default. Pieces and smaller substrates can be processed using carrier wafers (speak to tool responsible before running pieces). The tool can be reconfigured to 100 mm size if a very large number of 100 mm wafers are to be processed (speak with tool responsible).
Typical etch rates are 13 µm/min and to strip 1 µm resist takes 10 seconds.
High etch rates is achieved by having the chuck heated to 250 ºC during stripping.
Restrictions
Wafers with Au, Ag, Cr or Cu is not allowed in the tool. It is forbidden to have plastic films / adhesive tape on wafers.