HB16 Semi-Automatic Wedge & Ball Bonder
Primary use: Ball-Wedge wire bonding IC dies to packages using 25 µm gold wire
HB16 can be used in manual or semi-automatic mode.
Optional processes:
- Different wire thicknesses: 17 µm, 25 µm, 33 µm and 50 µm
- Different wire materials: gold or aluminium
- Ball-Wedge wire bonding or Wedge-Wedge wire bonding
- Gold ribbons for power devices
- Epoxy glue stamping and pick-and-place die-attachment for 1 mm x 1 mm chips
- Wire bond pull test
Some of the optional processes may become available on request (contact tool responsible).