• Gold ball stitch wire bonder

• Manufacturer: ESEC

• Model: 3100 plus

• Minimum loop height: 50 μm to 70 μm

• Maximum wire length: 9mm / 360mils

• Wire length <2.54mm ( 0.100”), +/–2.5 μm @ 3 sigma

• Magazine gripper with self-adjusting clamps

• Tunnel Buffer system

• Wire length >2.54 μm(0.100”), +/–1% wire length @ 3 sigma

• Auto focus capability

• Bond placement accuracy: ± 2.5 μm (3 sigma)

• Wire Cycle Time: 56msec ( standard loop) based on 2mm wire length, 0.25mm( 0.01”) loop height

• Fine Pitch : 35 μm in line @ 3 sigma

• Max bonding area: 52 x 70mm / 2 x 2.75”