Picture of CMP
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Linus Vik
2nd Responsible:
Nils Nordell
Files
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Description

CMP Chemical Mechanical Planarization.

Wafer sizes: 50, 75, 100, 150 mm

Processes: Si/SiGe, SiO2, SiC, InP

Details
Tool name:
CMP
Area/room:
C-CMP
Category:
Other processes
Manufacturer:
IPEC / Axus
Model:
Avanti 472
Tool rate:
D
Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
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