Technical description
Full equipment name: Disco DAD3241
General purpose: Dicing of Si, GaAs, SiC and glass wafers
Technical data:

• Manual Load, single wafer operation
• Auto cutting function
• Single spindle, output 1,8 KW, max 60 000 rpm
• Hub and hubless blades, o.d. hubless flange = 52 mm
• Non contact setup system
• Up to 200 mm wafer size