Single wafer wet processing
100 mm and 200 mm wafers
There are two processes available
2.5 % HF (Etch rate of PECVD SIO2 is about 140 nm/min, see process info)
H2SO4:H20
Etch rate of PECVD SIO2 from P5000 (SIOLDR) is 138 nm/min (2021-02-12)