Technical description
Full equipment name: Polyimide Bake Oven YES-450PB8-2/6-2
General purpose:
Curing of polyimide, benzocyclobutene (BCB) or similar resins in inert gas atmosphere and/or under reduced pressure.
Technical data:
• Stainless steel chamber with laminar flow system
• Preheated nitrogen flow (process gas)
• 200 mm wafer capability
• 5 heaters
• Process Temperature range: RT– 450 °C
Equipment inventory:
• 2 Cassettes for 100 mm wafers
• 1 Tool for load/unload cassette