General purpose: Production of thin films of a wide variety of oxides.UHV PLD Laboratory with integrated High-Pressure RHEED, Continuous Composition spread (CCS), DC ion gun for ion-assisted PLD and Target-Substrate Load-lock features. The PLD module features a load-lock designed for handling both 4-inch diameter wafers and Omicron sample holder. A vacuum suitcase for transporting the Omicron sample under UHV conditions is also included.
Some available compositions:
Al2O3, BaBiO3, BaTiO3, (BaSr)TiO3, Bi4Ti3O12, Bi4Ge3O12, CeO2, CuO
Er2O3 (available also for doping)
CMR manganites: LCMO, LSMO, LPMO etc. – available even on Si or GaAs substrate
Garnets: Gd3Ga5O12, Y3Fe5O12, (Ce-Y)3Fe5O12, Bi3Fe5O12, La3Ga5O12,Nb3Ga5O12
Sm3Ga5O12, Tb3Ga5O12, Y3Al5O12 etc.
In2O3-SnO2 (ITO), LaAlO3, (LaSr)CoO3, MgO, Nb2O5, SrTiO3, TiO2, TiN, Ta2O5,
Y2O3, YBa2Cu3O7 (available on Si), VO2, ZnO
Development processes for similar material types is available upon request.
Laser - Lambda Physik/ Coherent COMPExPro 110 Excimer Laser
- Wavelength: 248 nm
- Pulse energy: 400 mJ
- Maximum average power: 30W
- Maximum repetition rate: 100 Hz
Wafer sizes: 4” max
Base pressure (RT): 4 E-9 Torr
Temperature (max) at a substrate susceptor: 850 0C
Targets: 6 x 1” targets or 3 x 2” targets
Process gas: Oxygen, Nitrogen, Argon MFC controlled
Film uniformity : better than ± 5% across the 4” wafer (with beam scanning and 2” target)
High Pressure RHEED system. Capable of operation at pressures up to 400 mtorr. Includes
a STAIB 30 keV double differentially pumped RHEED gun, 30 keV power supply, fluorescent screen, CCD camera with zoom lens and a Computer with pre-loaded software for recording RHEED images and RHEED intensity oscillations.
Ion gun, 4 cm diameter Kaufmann source for ion-assisted deposition. The maximum kinetic energy of the ion beam is 1000 eV, maximum beam current for Argon ions is 60 mA. Process pressure range: 1 to 5 x 10^ -4 Torr.
Continous Composition Spread: Allows for continuous,binary, and ternary compositional spreads across 4-inch diameter substrate - target and Substrate indexing, laser triggering with the desired number of pulses for each target.
Restrictions: Toxic, corrosive, explosive, radioactive and other harmful substances. Usage of materials with high vapour pressure has to be discussed with manufacturer.