Picture of Gamma Photoresist Coater/Developer
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Arne Quellmalz
2nd Responsible:
Files
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Description

Technical description
Full equipment name: Suss Gamma 4M Cluster System
General purpose: Completely automated lithography cluster system allowing processing of 4", 6” & 8” wafers. Includes Vacuum Primer for HMDS, resist coater module, developer module, 2 hotplates, 1 cool plate & centering station.

Technical data:
Coater Station
• Photoresists: SPR 700-1.2, TCIR ZR8690 PB
• Resist in syringes: LOR, LOL, AZ etc.
• Spin speed range 10-5000 rpm (cover open); 10-3000 rpm (cover closed)
• Spin speed accuracy ± 1 rpm
• Acceleration 10-5000 rpm/s (cover open); 10-4000 rpm (cover closed)
• Lift pin mechanism
• Programmable dispense arm
• Backside Rinse & Frontside EBR
• Nozzle clean

Developer Station
• AZ 726 Developer
• Dispense arm for puddle development
• Spin speed range 10-6000rpm
• Acceleration 10-3000 rpm/s
• Programmable dispense arm
• Backside Rinse

Hotplate Cassette
• Two 250 °C Hotplates
• Temperature Range 60-250 °C
• Uniformity (up to 120 °C) ± 0.5 °C
• Uniformity (from 120 °C to 250 °C) ± 1.0 %
• Programmable Proximity 0.2-15 mm, step 0.1 mm
• Fixed Proximity 0.15 mm

Coolplate Cassette
• Temperature Range 60-250 °C
• Uniformity ± 0.2 °C
• Programmable Proximity 0.2-15 mm, step 0.1 mm
• Fixed Proximity 0.15 mm

Vacuum Primer for HMDS
• Temperature Range 60-200 °C
• Uniformity (up to 120 °C) ± 0.6 °C
• Uniformity (above 120 °C ) ± 1.2 °C
 

Details
Tool name:
Gamma Photoresist Coater/Developer
Area/room:
C-APL-ALS
Category:
Lithography
Manufacturer:
Suss Microtec
Model:
Gamma 4M
Tool rate:
C
Process info

Standard sequences

(0000) Coating SPR 700-1.2
• 100 mm: 0000 – 0249
• 150 mm: 0250 – 0499
• 200 mm: 0500 – 0749

Speed [rpm] 1000 2000 3000 4000 5000
Thickness [µm] 2.1 1.8 1.5 1.3 1.2

 

(1000) Coating TCIR ZR8690 PB
• 100 mm: 1000 – 1249
• 150 mm: 1250 – 1499
• 200 mm: 1500 – 1749

Speed [rpm] 1000 2000 3000 4000 5000
Thickness [µm] 6.2 4.5 3.8 3.3 3.1

 

(2000) Development AZ 726 MIF
• 100 mm: 2000 – 2249
• 150 mm: 2250 – 2499
• 200 mm: 2500 – 2749

(3000) Miscellaneous
• Temperature Init:                  3001
• Nozzle Clean:                       3002
• Water rinse 100 – 200 mm:   3003
• HMDS 100 – 200 mm:           3004
• EBR only:                             3006 – 3007
• Baking 95 C – 130 C:            3010 – 3020

(3250) Coating LDS (syringe)
• 100 mm LOR SB 150C5min:     3252 – 3256
• 150 mm LOR SB 150C5min:     3258 – 3262

Instructors & Licensed Users

Instructors

Licensed Users

Tool Modes
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