Technical description
Full equipment name: Maximus 804
General purpose:Coating and developing of photoresist film
Technical data:
• 2 resist pumps: Pump1: SPR 700 1.2, Pump2: AZ4533
• Resist syringe option
• 3 Media tanks: Tank 1: EBR, Tank 2: CD26 (developer), Tank 3: not used
• 1 HMDS station
• 2 Hotplates
• 1 Coolplate
• Wafer size 2"-3"-4"-6" (needs rebuilt to handle 2")
• Video prealigner
• Proximity wafer handler on hotplate (0mm - 11mm)
• Robot handling of wafers
• Coating speed max: 6000 rpm
• EBR and BSR in coater
• Developing speed max: 6000 rpm
• Puddle and pray nozzles in developer
• BSR in developer

Process specifications:
Hot plate temperature uniformity and control:
• + 0.5 ºC @ 100 ºC
• Max temperature 250 ºC
Cool plate temperature uniformity and control:
• + 0.5ºC @ 20-30ºC
Spin process uniformity:
• Photoresist uniformity (across wafer): < 15 Å (1 sigma)
• Photoresist uniformity (wafer-to-wafer): < 20 Å (1 sigma)