This ALS-Waferstepper 2035 g-line has been equipped with an extra hand held chuck system to allow various sized wafers of varying thicknesses.

There are hand held chucks for wafer sizes 2" to 8".

Smaller wafers can be handled with carriers.

Automatic loading for 8" is available.

Reticle: 5", 0.09″ thick

Exposure wavelength: 436nm

Exposure power (current): 220mW/cm²

Image field: ~ ∅20mm, largest square 14mm

Numerical aperture: 0.35

Magnification: 1/5X

Resolution: 1 μm (conservative value, never below 0.55-0.6µm for dense lines)

Depth of Focus (TIR): 1.75 μm

Total intrafield tolerance: 0.2µm

Masking: 4 independent masking blades, rectangular aperture only

Global alignment (3σ): 0.30μm (when carefully calibrated)

Local alignment (mapping), DFAS (Dark Field Alignment System) (3σ): 0.20μm