Technical description

Full equipment name: Wet bench 7-UP
W23
General purpose: Cleaning of wafers
Technical data:
• Chemicals: Sulphuric Acid (H2SO4), Hydrogen Peroxide (H2O2)
• Quartz bath for 6” wafers with heating and stirring (1)
• Bubbler for 6” (2)
• Aspirator
• DI Water-gun
• N2-gun
• Cassettes, cassette holders and single wafer holders marked green.

Full equipment name: Wet bench HF mix W11
General purpose: Etching of silicon oxide films
Technical data:
• Chemicals: Hydrofluoric acid (HF) (1)
• PVDF bath without heating (2)
• Bubbler
• Nitrogen gun
• Cassettes, cassette holders and single wafer holders marked green.

Full equipment name: Wet bench HF 1:10 W09
General purpose: Etching of silicon oxide films
Technical data:
• Chemicals: Hydrofluoric acid (HF)
• PVDF bath without heating (3)
• Bubbler (4)
• Aspirator
• Cassettes, cassette holders and single wafer holders marked green.

Full equipment name: Wet bench BHF W10
General purpose: Etching of silicon oxide films
Technical data:
• Chemicals: BHF (NH4F : HF 87.5 : 12.5 solution)
• PVDF bath without heating (5)
• Bubbler (6)
• Aspirator
• Cassettes, cassette holders and single wafer holders marked green.

Full equipment name: Wet bench Nitride W12
General purpose: Etching of silicon nitride films
Technical data:
• Chemicals: Phosphoric acid (H3PO4)
• PVDF bath with heating and cooling (7)
• PVDF bath for 5” wafers with heater with drain valve (8)
• Sink connected to acid drain (9)
• Aspirator
• DI Water gun
• Cassettes, cassette holders and single wafer holders marked green and red.