Full equipment name:Thin film interferometry, LEITZ MPV-SP
General purpose: Film thickness measurement based on interference analysis of the light reflected from the measured surface. Possible to create new combinations of single or double layers on substrate as long as the refractive indices and absorption coefficients for the chosen wavelength range are known.
Wafer size 4” or less
MPV-SP measuring instrument
PC and software ELMES-SP man
General description: Other Characterization