Technical description
Full equipment name:Thin film interferometry, LEITZ MPV-SP
General purpose: Film thickness measurement based on interference analysis of the light reflected from the measured surface. Possible to create new combinations of single or double layers on substrate as long as the refractive indices and absorption coefficients for the chosen wavelength range are known.
Technical data:
Wafer size 4” or less
Components:
MPV-SP measuring instrument
microscope
keypad
PC and software ELMES-SP man

General description: Other Characterization