Picture of Tegal
Current status:
AVAILABLE
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Technical description

Full equipment name: Plasmaline B300RF

General purpose: Dry etching of photoresist film in oxygen plasma.

Technical data:

  • RFX600 Advanced Energy
  • controller with PLC S7
  • Chamber heating max 100 C
  • Frequency 13.56 MHz
  • Max power 500 W
  • Process pressure: 1.3 mTorr
  • One gas line: Oxygen
  • Air cooling
  • Maximum wafer size: 5" x 25 wafers
Tool name:
Tegal
Area/room:
C-Q-Etch
Category:
Dry etching
Manufacturer:
Plasmaline
Model:
B300RF
Tool rate:
B
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Instructors

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