Technical description
Full equipment name: Model 20 Large Wirebonder
General purpose: Ultrasonic wire bonding to semiconductor or hybrid devices and their package terminals
Technical data:
• Wire Size Range: 3 to 25 mils (75 to 625 µm) Aluminium, Gold
• Stepback range: 0 to 0.3 inch (0 to 7.62 mm)
• Allows ultrasonic bonding of 4 to 20 mil (100 to 500 µm in dia.) Al and Au wire.
• With optional equipment also 3 mil and 25 mil wire and various types of ribbon can be handled.
• At present the equipment is set for 3 mil (75 µm) Al wire. This allows bonding to contacts with the minimum size 100 µm x 180 µm.