Oxford Instruments Plasmapro 100 ASP plasma enhanced ALD system with loadlock

Standard processes available: Nb-N, Ti-N, Al-O

Process gases: O₂, Ar, N₂, H₂

Configured for 4'' wafers (capable of up to 8'' with reconfiguration)

Electrode temperature range: room temperature -> 400 

Plasma power: ICP max 600 W, table RF max 300 W

Process pressure: ~1 mTorr - 2 Torr