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Oxford Instruments Plasmapro 100 Cobra 300 dry etching system with loadlock

Process gases: O2, Ar, CF4, CHF3, SF6, C4F8, N2

Configured for 4'' wafers (capable of up to 8'' with reconfiguration)

Wide temperature range electrode -150 -> 400 with He backside pressure

Plasma power: ICP max 3000 W, table RF max 600 W

Process pressure: ~1-250 mTorr

Tool name:
Cobra ICP-RIE Albanova
Area/room:
Albanova C1:3052
Category:
Dry etching
Manufacturer:
Oxford Instruments
Model:
Plasmapro 100 Cobra 300
Tool rate:
D

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