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Current status:
AVAILABLE
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The ULVAC Enviro-1Xa tool is used to stripp resist using a remote O2-plasma with low charging and etch damage on the wafer.

It is a single wafer tool that handles 100 mm wafers by default and can handle 150 mm wafer after 20 min re-configuration.

Typical etch rates are 13 µm/min and to stripp 1 µm resist takes 10 seconds.

High etch rates is achieved by having the chuck 250 ºC during stripping.

Wafers with Au or Cu is not allowed in the tool.

 

Tool name:
ULVAC
Area/room:
C-APL
Category:
Lithography
Manufacturer:
ULVAC
Model:
ENVIRO-1Xa
Tool rate:
D
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:
Flow Name Material Max etch time Stripp ends by:
Standard 1 µm 1 µm SPR 700-1.2 10 sec Time
Standard 3 µm 3 µm AZ4533 30 sec Time
Standard Endpoint Resist with 0.5 - 7 µm thickness 60 sec Endpoint + 100% overetch
Standard graphite Graphitised photoresist 60 sec Time


 

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