The ULVAC Enviro-1Xa tool is used to stripp resist using a remote O2-plasma with low charging and etch damage on the wafer.
It is a single wafer tool that handles 100 mm wafers by default and can handle 150 mm wafer after 20 min re-configuration.
Typical etch rates are 13 µm/min and to stripp 1 µm resist takes 10 seconds.
High etch rates is achieved by having the chuck 250 ºC during stripping.
Wafers with Au or Cu is not allowed in the tool.