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Current status:
AVAILABLE
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HB16 Semi-Automatic Wedge & Ball Bonder

Primary use: Ball-Wedge wire bonding IC dies to packages using 25 µm gold wire

HB16 can be used in manual or semi-automatic mode.

 

Optional processes:

  • Different wire thicknesses: 17 µm, 25 µm, 33 µm and 50 µm
  • Different wire materials: gold or aluminium
  • Ball-Wedge wire bonding or Wedge-Wedge wire bonding
  • Gold ribbons for power devices
  • Epoxy glue stamping and pick-and-place die-attachment for 1 mm x 1 mm chips
  • Wire bond pull test

Some of the optional processes may become available on request (contact tool responsible).

Tool name:
HB16-TPT
Area/room:
Y-ES-lab 3390
Category:
Device mounting
Manufacturer:
TPT
Model:
HB16
Tool rate:
C
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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