Picture of Disco-saw
Current status:
AVAILABLE
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Technical description
Full equipment name: Disco DAD3241
General purpose: Dicing of Si, GaAs, SiC and glass wafers
Technical data:

  • Manual Load, single wafer operation
  • Auto cutting function
  • Single spindle, output 1,8 KW, max 60 000 rpm
  • Hub and hubless blades, o.d. hubless flange = 52 mm
  • Non contact setup system
  • Up to 200 mm wafer size
     

 

 

Tool name:
Disco-saw
Area/room:
C-DISCO saw
Category:
Sawing
Manufacturer:
Disco
Model:
DAD3241
Tool rate:
D
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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