Picture of Disco-saw
Current status:
AVAILABLE
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Technical description
Full equipment name: Disco DFD640 saw
General purpose: Dicing of Si, GaAs, SiC and glass wafers
Technical data:
• Fully automatic, high speed, precision dicing machine
• Single spindle, output 1 KW, max 60 000 rpm
• Max. blade size 61 mm diameter
• Non contact setup system
• Up to 200 mm wafer size
 

Tool name:
Disco-saw
Area/room:
C-DISCO saw
Category:
Sawing
Manufacturer:
Disco
Model:
DFD640
Tool rate:
C
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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