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Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
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Single wafer wet processing

100 mm and 200 mm wafers

There are two processes available

2.5 % HF (Etch rate of PECVD SIO2 is about 140 nm/min, see process info)

H2SO4:H20

Tool name:
SSEC
Area/room:
C-RIBE
Category:
Wet process benches
Manufacturer:
Vecco
Model:
SSEC 3300
Tool rate:
A
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

Etch rate of PECVD SIO2 from P5000 (SIOLDR) is 138 nm/min  (2021-02-12)

Instructors

Licensed Users

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