Application: Ion Beam Etching, Reactive Ion Beam Etching, Chemically Assisted Ion Beam Etching.

• Stainless steel chamber pumped by a Pfeiffer 1500 turbo pump and backed by an Adixen A103P Rotary pump. Base pressure ~5.5E-07 Torr.
• Automatic loadlock pumped by an Alcatel ATP80 turbo pump backed by an Adixen ACP15G rotary pump.
• 15cm 1.25kW etch RF ion source, with three circular etch grids.
• 200 mm platen with variable rotation speed (max 20 rpm).
• Tiltable substrate holder can be angled from -90° (loading position) to +8°.
• Fluid- cooled rotating specimen holder with shutter.
• Helium wafer backside cooling.
• Platen heating up to 250°C and cooling down to 10°C.
• Gas pod with Ar, O2, N2, H2, CH4, Cl2, BCl3 and SiCl4 lines.
• Manually retractable SIMS probe with valve, pumped by an Alcatel ATP80 turbo pump, backed by an Adixen ACP15G rotary pump.
• Verity optical endpoint detection system mounted on platen itself.