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Oxford Plasmalab 100 dry etching system.

Process gases O2, Ar, CF4, CHF3, SF6, Cl2, sample size max 2 inch. Inductive Coupled Plasma (ICP), Helium backside cooling, temperature controlled electrode.

More info here.

Tool name:
Cryo RIE Albanova
Area/room:
Albanova C1:3052
Category:
Dry etching
Manufacturer:
Oxford
Model:
Plasmalab 100
Tool rate:
D
Max booking time, day:
6 hours
Max booking time, night:
12 hours
No. of future bookings:
4

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