Technical description
Full equipment name: Mask aligner(Bond aligner MA8/BA8 Karl Suss
General purpose: Mask aligner, principally for backside alignment and prebond alignment
Technical data:
• 1000 W exposure lamp, Hg
• Allowed substrates: 8, 6, 4, 3, 2 inch and wafer pieces
• Wafer thickness up to 8 mm
• Exposure modes: Hard Contact, Soft Contact, Low Vacuum Contact, Vacuum Contact, Proximity
• Alignment modes: Front, Backside and Pre-bond Alignment
Inventory:
Chucks
• 2 pcs of 4 inch chucks, glass – Front- and backside alignment + aligment against the flat. Only one of these chucks has an inflatable rubber ring.
• 2, 3, 6 and 8 inch chucks.
Maskholder
• 4 inch (possible to use proximity)
• 2, 3, 6 and 8 inch
Adapter
• Mask holder adaptor has to be replaced to run 8 inch.
• Front- and backside alignment
I-line filter
• For thick negative resist and polyimide
If you need to install this contact the machine responsible
Attention! Don’t forget to dismount the I-line filter after using it.
Special Lenses
For rough structures. If you need to install this contact the machine responsible.
IR objectives
Special IR objectives are available for the TSA microscope.