Full equipment name: Horiba UVISEL ER
Ellipsometry is used to determine thickness (1Å to 30 µm) and optical constant (n,k,alpha, optical band gap) of materials, such as thin oxides or nitrides on top of semiconducting substrates (Si, Ge, GaAs, SiC, ...) , thin metal film (thickness smaller than 50 nm), resists, chemical and biological engineering and dynamic studies.
The Horiba UVISEL ER tool covers a spectral range of 190 nm to 2100 nm. The angle can be adjusted automatically from 55 to 90°. By modeling the optical parameters of single layers and of multilayer can be extracted. The composition of alloys such as SixGe(1-x) can be determined. Roughness and porosity studies of thin films can be performed. Models for graded optical constants can be implemented. In addition anisotropic structures, uniaxial and biaxial films can be investigated.
The measurement setup is capable of performing wafer maps of up to 8 inch wafer. The spot size of the measurement can be chosen to be 1x3 mm, 100x300 microns or 50x150 microns. In addition kinetic (time dependent) measurements can be performed.
General description: Other Characterization