Picture of Gamma
Current status:
AVAILABLE
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Technical description
Full equipment name: Suss Gamma 4M Cluster System
General purpose: Completely automated lithography cluster system allowing processing of 6” & 8” wafers. Includes Vacuum Primer for HMDS, resist coater module, developer module, 2 hotplates, 1 cool plate & centering station.
Technical data:


Coater Station
• SPR 700- 1.2 Photoresist 
• Spin speed range 10-5000 rpm (cover open); 10-3000 rpm (cover closed)
• Spin speed accuracy ± 1 rpm
• Acceleration 10-5000 rpm/s (cover open); 10-4000 rpm (cover closed)
• Lift pin mechanism
• Programmable dispense arm
• Backside Rinse & Frontside EBR
• Nozzle clean

Developer Station
• AZ 726 Developer
• Dispense arm for puddle development
• Spin speed range 10-6000rpm
• Acceleration 10-3000 rpm/s
• Programmable dispense arm
• Backside Rinse

Hotplate Cassette
• Two 250 °C Hotplates
• Temperature Range 60-250 °C
• Uniformity (up to 120 °C) ± 0.5 °C
• Uniformity (from 120 °C to 250 °C) ± 1.0 %
• Programmable Proximity 0.2-15 mm, step 0.1 mm
• Fixed Proximity 0.15 mm

Coolplate Cassette
• Temperature Range 60-250 °C
• Uniformity ± 0.2 °C
• Programmable Proximity 0.2-15 mm, step 0.1 mm
• Fixed Proximity 0.15 mm

Vacuum Primer for HMDS
• Temperature Range 60-200 °C
• Uniformity (up to 120 °C) ± 0.6 °C
• Uniformity (above 120 °C ) ± 1.2 °C
 

Tool name:
Gamma
Area/room:
C-APL-Centura
Category:
Lithography
Manufacturer:
Suss Microtec
Model:
Gamma 4M
Tool rate:
C
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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