Full equipment name: F&K Devoltec 5410 Wire Bonder
General purpose: Bonding of Au wire (17.5 - 50 µm) to/from chips from/to different carriers.
• Wire guide 90° wire feed.
• 2 Stepper motor driven Y and Z axes Single board PC controller, menu programming.
• Y axis: 50 mm, Z axis: 50 mm; 2.5 µm / 1.25 µm resolution.
• Standard work height 136 mm (mid Z stroke)
• X/Y manipulator from 5x5 mm to 18x18 mm
• Equivalent manipulator step-down 1:2 to 1:7
• Heated work holder with integrated digital temperature control up to 360°C.
• Up to 50 individual wires per program, 250 programs per 3.5“ floppy disk, can be edited and printed as text files via PC
• Leica Model Zoom microscope with illuminator
• Deep access needle and accessory