Picture of Ball bonder
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WARNING
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Technical description
Full equipment name: F&K Devoltec 5410 Wire Bonder
General purpose: Bonding of Au wire (17.5 - 50 µm) to/from chips from/to different carriers.
Technical data:
• Wire guide 90° wire feed.
• 2 Stepper motor driven Y and Z axes Single board PC controller, menu programming.
• Y axis: 50 mm, Z axis: 50 mm; 2.5 µm / 1.25 µm resolution.
• Standard work height 136 mm (mid Z stroke)
• X/Y manipulator from 5x5 mm to 18x18 mm
• Equivalent manipulator step-down 1:2 to 1:7
• Heated work holder with integrated digital temperature control up to 360°C.
• Up to 50 individual wires per program, 250 programs per 3.5“ floppy disk, can be edited and printed as text files via PC
Equipment inventory:
• Workholder
• Leica Model Zoom microscope with illuminator
• Deep access needle and accessory
 

Tool name:
Ball bonder
Area/room:
Y-yttrelab
Category:
Device mounting
Manufacturer:
F&K Delvotec Semiconductor GmbH
Model:
5410
Tool rate:
B
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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