This ALS-Waferstepper 2035 g-line has been equipped with an extra hand held chuck system to allow various sized wafers of varying thicknesses.
There are hand held chucks for wafer sizes 2" to 8".
Smaller wafers can be handled with carriers.
Automatic loading for 8" is available.
Reticle: 5", 0.09″ thick
Exposure wavelength: 436nm
Exposure power (current): 220mW/cm2
Image field: ~ ∅20mm, largest square 14mm
Numerical aperture: 0.35
Resolution: 1 μm (conservative value, never below 0.55-0.6µm for dense lines)
Depth of Focus (TIR): 1.75 μm
Total intrafield tolerance: 0.2µm
Masking: 4 independent masking blades, rectangular aperture only
Global alignment (3σ): 0.30μm (when carefully calibrated)
Local alignment (mapping), DFAS (Dark Field Alignment System) (3σ): 0.20μm