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Technical description
8" dry etcher.
Chamber A for deep trench Si etch
Chamber B for oxide/nitride etch.
DPS DT silicon chamber under C&F engineering development, hardware changes mean etch will not be consistent. Carrier for other wafer sizes can be used with some process restrictions and limitations.
 

Tool name:
Centura
Area/room:
C-APL-Centura
Category:
Dry etching
Manufacturer:
Applied Materials
Model:
Centura II (DPS & MxP)
Tool rate:
D
Max booking time, day:
8 hours
Max booking time, night:
hours
No. of future bookings:
3

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