Technical description
Full equipment name: West•Bond 7476E-79 Manual Wedge-Wedge Wire Bonder
General purpose: Bonding of Au or Al-wire to/from chips from/to different carriers.
Technical data:
• Two-Way convertibility, 45° wire feed, or 90° wire and ribbon feed.
• Pure vertical Z-movement and adjustable height platform.
• Machine components positioned above the horizontal bond plane and thus eliminating any restrictions to package size or shape.
• 30 available buffers for bond settings.
Equipment inventory:
• Free Furnace Workholder with West•Bond 1200D Temperature Controller
• Leica Model Zoom microscope with illuminator
• Deep access needle and accessory
• Power switchbox with 220/100V transformer