Picture of Pamela
Current status:
DOWN
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Technical description
Full equipment name: STS 308PC
General purpose: Strip resist on 100 mm wafers using O2 plasma

Technical data:
• Barrel plasma etch
• Batch chamber, can handle 100 of 100 mm wafers, 50 of 150 mm wafers
Manual loading
• Installed process gases: O2
• Process pressure: about 1.5 Torr
• Plasma power max: 600 W
• Chamber heater

Capabilities:
Remove resist using O2 plasma in a barrel system

Restrictions:
Substrate size (max): 150 mm
Substrate size (min): pieces
Substrate restrictions: No gold contaminated wafers
Batch processing:Yes
 

Tool name:
Pamela
Area/room:
C-Anneal
Category:
Dry etching
Manufacturer:
STS
Model:
308PC (RF Plasma Asher)
Tool rate:
B
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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