Picture of Filippa
Current status:
AVAILABLE
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Responsibles
1st Responsible:
Magnus Lindberg
2nd Responsible:
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Description

Technical description
Full equipment name: SussMicrotec Automatic Flip Chip Bonder FC150
General purpose: Flip Chip bonding of Focal Plane Arrays (FPAs), multichip modules etc.
Technical data:
• Universal bonding arm, force: 0,03 kg - 100 kg
• Chuck & arm temperature: RT- 450 °C
• Chuck & Arm tool size: 50x50 mm
• Chuck travel resolution: 1 µm
• Bonding accuracy (ideal conditions): +/-3 µm
 

Details
Tool name:
Filippa
Area/room:
C-Hybridisering
Category:
Device mounting
Manufacturer:
SussMicrotec
Model:
Automatic Flip Chip Bonder FC150
Tool rate:
D
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Tool Modes
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