Picture of AJA Sputter
Current status:
AVAILABLE
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1st Responsible:
2nd Responsible:
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Targets available for use in the chamber chamber are numerous. Typical materials are: Pt, NiFe, Co, Ni CoFe, Ta, Cu

IF YOU WANT A SPECIFIC MATERIAL INSTALLED IN THE CHAMBER CONTACT TOOL RESPONSIBLE

GENERAL RULES:
You may not change the targets yourself. Please contact the tool responsible if you need this done.
Technical description
Full equipment name: AJA ATC Orion-8 Magnetron Sputtering System
General purpose: Thin Film Deposition
Technical data:
• All kinds of metallic and insulator thin film deposition with fine control of thickness
• 7 magnetron guns, 2 DC power supplies and 2 RF power supplies (one for RF sputtering and another for RF substrate bias). At best 3 guns co-sputtering deposition
• 2 chambers (one main chamber for deposition and another load-lock chamber for transferring substrate). Base pressure better than 5e-8 Torr
Working gas: Argon for normal deposition. Max. working pressure 50 mTorr and Min. working pressure 1.5 mTorr. Reactive gases, oxygen or nitrogen, are available if necessary.
Achived uniformity: +/- 1.5 % for 4" wafers. Achieved growth rates depend on materials, power and working gas pressure, ranging from 0.1 A/s to 3 A/s

Tool name:
AJA Sputter
Area/room:
Y-Synth labs
Category:
Thin film deposition
Manufacturer:
AJA International
Model:
ATC Orion-8
Tool rate:
D
Max booking time, day:
hours
Max booking time, night:
hours
No. of future bookings:

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